LG Showcases Advanced AI Data Center Cooling Solutions at Data Center World 2025
LG Electronics is making its first appearance at Data Center World (DCW) 2025 in Washington, D.C., unveiling a wide-ranging lineup of innovative cooling solutions designed specifically for modern data centers.
From April 14 to 17, the event will see LG debut cutting-edge offerings, including high-efficiency chillers, air- and liquid-based server cooling technologies, and its AI-driven Building Energy Control (BECON) platform. These solutions aim to support the evolving demands of AI data centers, which generate higher heat loads and require more efficient thermal management due to their increased computing density.
Revolutionary Direct-to-Chip Cooling Technology
One of the key highlights of LG’s booth is its liquid server cooling technology featuring Direct-to-Chip (D2C) capabilities. This technology cools server chips directly using LG’s advanced heat exchangers and inverter pumps, significantly improving energy efficiency.
The company’s Coolant Distribution Unit (CDU), designed for compact and modular deployment, regulates coolant temperature and flow using Active Load Sharing for optimal system performance. Equipped with redundant sensors, a 10.4-inch touchscreen interface, and self-diagnostic tools, the CDU offers both reliability and ease of maintenance.
LG’s new Cold Plate solution, designed for high-TDP chips, features a parallel coolant flow system, a skived fin heat exchanger for optimal heat transfer, and AI-driven thermal customization. It’s built for durability with brazed joints and triple inspections to prevent leaks.
High-Efficiency Chillers and Cooling Units for AI Workloads
LG is promoting its advanced chiller systems as key components in AI data centers. The Water-Cooled Oil-Free Centrifugal Chiller uses magnetic bearing tech (LeviTech™) and machine learning for high energy efficiency and reliability.
The Air-Cooled Chiller lineup offers free-cooling modes and backup systems for stability. LG’s CRAH units feature energy-efficient EC fans and modular designs for room-level cooling for easier maintenance and installation.
Also read: World’s Largest Data Center Expo Set to Begin
James Lee, president of the LG ES Company, said, “The exceptional LG thermal management solutions on show at Data Center World 2025 leverage our latest AI technologies and the considerable insight gained from our partnerships with AI data centers worldwide.”
He added, “As a leading provider of innovative HVAC solutions, LG will continue pushing forward to deliver efficient cooling infrastructure for North America’s fast-growing AI data center market.”
AI-Integrated Cooling Control with BECON
LG is leveraging its BECON platform to unify and optimize all these systems. The AI-powered energy control solution allows seamless integration of chiller, D2C, and room cooling systems across multiple zones in a facility.
BECON ensures ideal temperature and humidity levels, while its advanced analytics capabilities help reduce energy consumption and operational costs, addressing the continuous cooling demands of AI-driven data centers.
